Nick Lanzillo

Publications

• Exploring Unconventional Resistivity Scaling in Topological Semimetals for Interconnects Beyond Copper

  • • Ching-Tzu Chen
    • Christian Lavoie
    • et al.
  • 2023
  • APS March Meeting 2023

• Methodology Development to Benchmark Power Delivery Designs in Advanced Technology Nodes

  • • Nicholas A. Lanzillo
    • A. Chu
    • et al.
  • 2023
  • SPIE Advanced Lithography + Patterning 2023

• Next-Generation Logic Design Architecture for Vertical-Transport Nanosheets

  • • Biswanath (Biswa) Senapati
    • Jeongho Do
    • et al.
  • 2023
  • SPIE Advanced Lithography + Patterning 2023

• Unconventional resistivity scaling in topological semimetal CoSi

  • • Shang-Wei Lien
    • Ion Garate
    • et al.
  • 2023
  • npj Quantum Materials

• Subtractive Ru Interconnect Enabled by Novel Patterning Solution for EUV Double Patterning and TopVia with Embedded Airgap Integration for Post Cu Interconnect Scaling

  • • C. J. Penny
    • Koichi Motoyama
    • et al.
  • 2022
  • IEDM 2022

• Size-Dependent Grain-Boundary Scattering in Topological Semimetals

  • • Nicholas A. Lanzillo
    • Utkarsh Bajpai
    • et al.
  • 2022
  • Physical Review Applied

• Reliability and resistance projections for rhodium and iridium interconnects from first-principles

  • • Nicholas A. Lanzillo
    • Daniel C. Edelstein
  • 2022
  • Journal of Vacuum Science and Technology B

• Capacitive Impacts of Etch-Induced Dielectric Damage in Highly-Scaled Interconnect Architectures

  • • Janet M. Wilson
    • Nicholas A. Lanzillo
  • 2022
  • IITC 2022

• Metal-induced line width variability challenge and mitigation strategy in advanced post-Cu interconnects

  • • Koichi Motoyama
    • Nicholas A. Lanzillo
    • et al.
  • 2022
  • IITC 2022

• Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects

  • • Takeshi Nogami
    • Oleg Gluschenkov
    • et al.
  • 2022
  • VLSI Technology and Circuits 2022