Evaluating the Potential of Weyl Semimetals as Future Interconnect Metals
- Sushant Kumar
- Yi-Hsin Tu
- et al.
- 2022
- MRS Spring Meeting 2022
Bio
Nick earned a B.S. in physics from Syracuse University and a Ph.D. in physics from Rensselaer Polytechnic Institute (RPI) in Troy, NY. He joined IBM in 2016 as part of the back-end-of-line (BEOL) integration team and currently works on leading edge technology development with a focus on design-technology co-optimization (DTCO.) Nick was named an IBM Master Inventor in 2020 and again in 2023. He currently serves on the committee for the IEEE International Interconnect Technology Conference.
Publications
Area-Selective Deposition of Tantalum Nitride with Polymerizable Monolayers: From Liquid to Vapor Phase Inhibitors
- Krystelle Lionti
- Noel Arellano
- et al.
- 2022
- Chemistry of Materials
Resistivity scaling in topological semimetal CoSi
- Hsin Lin
- Shang-Wei Lien
- et al.
- 2022
- APS March Meeting 2022
Benchmarking Power Delivery Network Designs at the 5-nm Technology Node
- Nicholas A. Lanzillo
- Albert M. Chu
- et al.
- 2021
- IEEE T-ED
Power Delivery Design, Signal Routing, and Performance of On-Chip Cobalt Interconnects in Advanced Technology Nodes
- Nicholas A. Lanzillo
- Albert Chu
- et al.
- 2021
- IEEE Transactions on VLSI Systems
Electromigration and Line R of Graphene Capped Cu Dual Damascene Interconnect
- T. Nogami
- S. Nguyen
- et al.
- 2021
- IEDM 2021
Dual Damascene BEOL Extendibility With Cu Reflow / Selective TaN And Co/Cu Composite
- P. Bhosale
- N. Lanzillo
- et al.
- 2021
- VLSI Technology 2021
Additive Lithography - Organic Monolayer Patterning Coupled with an Area-Selective Deposition
- Rudy Wojtecki
- Jonathan Ma
- et al.
- 2021
- ACS AMI
Interconnect scaling challenges, and opportunities to enable system-level performance beyond 30 nm pitch
- Griselda Bonilla
- Nicholas A. Lanzillo
- et al.
- 2020
- IEDM 2020
Topological semimetals for scaled back-end-of-line interconnect beyond Cu
- Ching-Tzu Chen
- Utkarsh Bajpai
- et al.
- 2020
- IEDM 2020
Patents
Top collaborators
DD
Dan J. Dechene
Director, Semiconductor Enablement
OG
Oki Gunawan
Research Staff Member
NM
Nathan Marchack
Staff Research Scientist, Quantum and AI Hardware Research
GC
Guy Cohen
Research Staff Member