Accurate Metallization Capacitances for Integrated Circuits and Packages

Abstract

The parallel-plate formula is widely used by the solid-state circuit designer to estimate capacitances in integrated circuits. Since considerable errors may result from using this approximation, this correspondence gives correction curves for a wide range of parameters. It is shown that the finite conductor thickness may significantly contribute to the increase in capacitance. Copyright š 1973 by The Institute of Electrical and Electronics Engineers, Inc.