Adhesion and XPS studies on a fluoropolymer-metal interface

Abstract

Adhesion between a glass-fiber-filled Teflon PFAR (tetrafluoroethylene and perfluoro- alkoxyvinyl ether co-polymer) film and chromium-coated copper foil was studied. Excellent PFA- copper adhesion was achieved by high temperature lamination at 380°C. X-Ray photoelectron spectroscopy (XPS) studies revealed chemical reactions, defluorination reactions, and metal fluoride formation at the interface. The PFA surface created by etching the laminated copper foil in a ferric chloride solution was found to be quite different in surface properties from that of pure PFA. © 1991, VSP. All rights reserved.