Bending of flex leads during thermal cycling

Abstract

A three dimensional finite-element stress model was used to stimulate the lead bending incurred during thermal cycling of a Flex connector joined to a silicon carrier via an eutectic solder. Three different coating conditions (no coating, with a polyimide coating, and with a silicone coating) were simulated. With the polyimide coating, lead bending was found to occur at the corner inner leads of the Flex as a result of the plastic strains accumulated there during thermal cycling.