Chromium mask damage in excimer laser projection processing

Abstract

Cr masks used for conventional optical lithography were evaluated for their damage under excimer laser irradiation at 248 nm and 308 nm. The damage of Cr films on quartz ranged from erosion of pattern edges to total ablation depending on the fluence. At low fluences, cumulative stressing of the Cr films by the laser pulses leads to development of fine cracks. Difference in damage threshold at 248 nm and 308 nm was observed. © 1988, SPIE.