Dielectric anti-reflection coating application in a 0.175 μm dual-damascene process

Abstract

Various dielectric anti-reflection coatings (DARCs) were evaluated using 0.175 μm dual-damascene structures to examine the lithography process window and integration capability. Double-DARC layers have been developed with the optimum refractive indices and thickness, based on reflectance simulations and measurements, to provide better critical dimension (CD) control as compared to organic ARC and single-DARC layer applications. The integration scheme using a double-DARC layer provides substantial benefit for 0.175 μm metallization.