Electrical capability assessment for high wiring density organic interposer

Abstract

Silicon and glass interposers provide a solution to keep scaling of C4 dimensions and chip-to-chip interconnect density by supporting high bandwidth. However there are still some challenges in the fabrication process and cost. As another alternative solution, organic material would be a candidate. In order to perform the feasibility study for allowable bandwidth with organic material, various electrical parametric analyses were performed assuming simple chip-to-chip bus connection in the region of less than 10μm trace width. The results are indicating that the bandwidth with assumed organic material is comparable or more to one with SiO2 material and the trace width to obtain the bandwidth peak is 1-2μm. © 2013 IEEE.