Etching and deposition of polyimides by electrochemical methods

Abstract

We describe a new method for etching and direct electrodeposition of polyimides based on their inherent electrochemical properties. Film etching can be accomplished by exposing the film to a solution containing an organic reducing agent that is generated by a bulk electrolysis technique. Highly anisotropic etch profiles have been obtained using a patterned metal etch mask. Reduced polyimide anionic salts can be used to electrochemically deposit fully imidized polyimide onto a conductive surface.