Film properties and integration of a composite PECVD FSG film

Abstract

A single pass-multistation deposition tool was used to deposit an IMD film which consisted of multiple FSG layers with optimized interfaces between the layers. The composite film had improved stability, F diffusion resistance, and electrical properties compared with monolithic FSG films. This film has been successfully integrated into a 0.13 μm Cu technology which uses a spin-on low k dielectric for the thin wires and FSG for the fat wires.