INTEGRATED CIRCUIT FABRICATION - A PROCESS OVERVIEW.

Abstract

The key unit processes outlined are chemical vapor deposition, oxidation, diffusion and ion implantation, metallization and lithography. The most critical advances have been in lithography and etching, where electron-beam systems along with plasma-assisted etching techniques, have enabled further miniaturization. New materials have been developed including low resistivity silicides. The interaction of computer aided design, process simulation, production/process control, in-process measurement, characterization and final testing play a critical role in VLSI fabrication technology.