Kinetic analysis of electroless deposition of copper

Abstract

Kinetic data on electroless copper deposition from a formaldehyde/EDTA solution are analyzed and discussed in terms of a formal kinetic rate law. The derived rate equation shows first-order dependence on the methylene glycol anion and zeroth order on cupric ion. Kinetic preexponential factors evaluated from temperature dependencies of reaction rates indicate that the rate-determining step involves an adsorbed species. A primary kinetic isotope effect kH/kD = 5 upon substitution of deuterium for protium in formaldehyde indicates that cleavage of the carbon-hydrogen bond of the adsorbed methylene glycol anion is rate determining. © 1985 American Chemical Society.