Laser Attach Process Development and material selection

Abstract

Wafer-scale laser attach process development, that includes optical encapsulant material selection for efficient and reliable laser to silicon photonic coupling are presented here. A hybrid flip-chip 3D heterogenous integration of III-V laser component into Silicon Photonics chip cavity using laser-assisted Bonding technic is used. Power up to 16 dBm injected in the PIC waveguide was achieved using high precision alignment strategies; and advanced early reliability assessment tests of the encapsulant materials were performed to screen various candidates and demonstrate effective mechanical joint protection as well as electrical and optical performance stability over the stresses test. A median optical degradation delta of less than 0.4dB after the stresses have been recorded which is within the measurement error of the test setup.