Laser writing of copper lines from metalorganic films

Abstract

Direct writing of high-purity copper lines has been achieved by photothermal decomposition of copper formate films under ambient conditions using a focused argon ion laser (514 nm) beam on a scanning quartz or silicon substrate. The fast decomposition kinetics of the precursor allows use of writing speeds as high as 1 cm/s for deposition of micron-thick copper films. There is negligible oxidation of the copper after decomposition in the presence of air due to the rapid heating and cooling of the deposit during laser writing.