Packaging Technology for Josephson Integrated Circuits

Abstract

Packaging technology used to build the first system cross-section test vehicle in Josephson technology is described. A three-dimensional modular card-on-board packaging approach has been selected to fabricate the test vehicle which incorporates all the essential features of the technology required to build a high performance processor prototype. Potential viability of the described packaging technology for the fabrication of such a prototype has been demonstrated by an experiment in which a critical data path has been successfully operated with a minimum cycle time of 3.7 ns. © 1982 IEEE