Publication
FiO 2012
Conference paper

Polymer optical waveguide based single mode connector for silicon photonics packaging

Abstract

We realized a passively aligned waveguide connector for a silicon photonic chip packaging. We used lithographically defined top clad patterning to realize fine alignment grooves which mate with notches in the ferrule passively. © OSA 2012.

Date

Publication

FiO 2012

Authors

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