Process characterization of Josephson packaging technology

Abstract

Process characterization is an essential step in the development of circuit chips and package parts for the Josephson technology. In our laboratory various test vehicles were designed with test sites to explore new designs and processes, to provide in-process and end-of-process evaluations of fabrication runs as well as to serve as powerful diagnositc tools. This article describes some of the process characterizations used in the package for the first system level test vehicle in the Josephson technology. The types of electrical characterizations, the full vertical structures, requirements of package parts and major process steps are discussed. Results from wiring contacts, and insulation sites are used to illustrate the nature of this work and will benefit the development of a prototype machine in suggesting areas that require special attention. © 1983 IEEE