Progress in circuit oriented techniques for electrical interconnect and package (EIP) modeling

Abstract

The tools and techniques for EIP modeling are continuously evolving perhaps at a slower pace than the VLSI system technology. VLSI systems involve millions of components and it is impossible to exactly model such complex systems. Continuous progress in the tools and techniques allows the modeling of larger portions of such systems. This paper summarizes recent progress of circuit oriented techniques for EIP and gives an outline of some new techniques and issues for the solution of larger systems in the time domain.