Refrigeration technologies for sub-ambient temperature operation of computing systems

Abstract

Two different refrigeration technologies developed for server applications are described. While mechanical vapor-compression systems solved the refrigeration problems in high end servers and few processor systems, advanced thermoelectric coolers were stated to offer promising solutions for sub-ambient operation of low-end servers, parallel processor systems and extending the temperature differentials in vapor-compression systems. Thin film thermoelectric coolers were described to be ideal for sub-ambient operation of complementary metal oxide semiconductor (CMOS) circuits.