Synthesis and Characterization of Reactive End-Capped Polymide Oligomers

Abstract

A series of reactive, end-capped, polyimide oligomers has been prepared for possible use as planarizing coatings in the electronics industry. Thus, 1,3-bis(3-aminophenoxy)benzene was treated with various excess amounts of 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride in m-cresol containing toluene and isoquinoline. The resulting anhydride-terminated amic-acid oligomers were thermally imidized and then allowed t o react with 3-aminophenylethyne, l-phenyl-4-(3-aminophenyl)buta-l-ene-3-yne, l-phenyl-4-(3-aminophenyl)- l,3-butadiyne, 2-aminobiphenylene, or 1-phenyl-2- (3-aminopheny1) ethyne. Thermal imidization of these intermediates produced the corresponding end-capped polyimide oligomers. The white oligomers were soluble in organic solvents, such as diglyme, and had glass transition temperatures (Tg's) between 95 and 145ºC. The Tg of an ethynyl-terminated oligomer was reduced from 105 t o 62ºC upon the incorporation of 20 wt % of the reactive plasticizer bis[2-(3- ethynylphenoxyjethy?.]ether. The oligomers underwent exothermic polymerizations between 225 and 420ºC.Their TGA thermograms showed 5% weight losses near 530ºC in air. © 1984, Taylor & Francis Group, LLC. All rights reserved.