Polyimide on copper: The role of solvent in the formation of copper precipitates
- Steven P. Kowalczyk
- Young-Ho Kim
- et al.
- 1988
- Applied Physics Letters
Publications
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18 results for J. Kim
Summary Abstract: Polyimide-copper interfaces: Growth sequence dependence and solvent effects
- Steven P. Kowalczyk
- Young H. Kim
- et al.
- 1988
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Coevaporation of Cr-Cu and Mo-Ag
- J. Kim
- S.H. Wen
- et al.
- 1988
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Adhesion and interface investigation of polyimide on metals
- Y.-H. Kim
- J. Kim
- et al.
- 1988
- Journal of Adhesion Science and Technology
Adhesion of titanium thin film to oxide substrates
- Y.H. Kim
- Y.S. Chaug
- et al.
- 1987
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Adhesion and interface studies between copper and polyimide
- Y.-H. Kim
- G.F. Walker
- et al.
- 1987
- Journal of Adhesion Science and Technology
Structures of co-evaporated copper alloys
- J. Kim
- D.S. Yee
- 1985
- Thin Solid Films
Characterization of ternary Cu-Sn-Au bulk alloys and thin films
- J. Kim
- 1984
- Journal of Electronic Materials