Removal of Fluorocarbon Residues on CF4/H2 Reactive-ion-Etched Silicon Surfaces Using a Hydrogen Plasma
- J. Simko
- G.S. Oehrlein
- et al.
- 2019
- JES
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2 results for J. Simko
Thermal stress-induced and electromigration-induced void-open failures in Al and Al-Cu fine lines
- T. Kwok
- K.K. Chan
- et al.
- 1991
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films