Effect of the specimen size in predicting the mechanical properties of PbSn solder alloys
- N.R. Bonda
- I.C. Noyan
- 1996
- IEEE Transactions on Components Packaging and Manufacturing Technology Part A
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.