Evaluation of low stress photo-sensitive spin on dielectric layers for through silicon via (TSV) copper redistribution layers
- Christopher Jahnes
- Eric Huenger
- et al.
- 2011
- ISHVAC 2011
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.