Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies
- Chuan Xu
- Lijun Jiang
- et al.
- 2009
- ICCAD 2009
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This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
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2 results for Seshadri K. Kolluri
Thermal modeling of on-chip interconnects and 3D packaging using EM tools
- Lijun Jiang
- Seshadri Kolluri
- et al.
- 2008
- EPEPS 2008