Study of two-phase pressure drop and heat transfer in a micro-scale pin fin cavity: Part B
- Pritish R. Parida
- Arvind Sridhar
- et al.
- 2016
- ITherm 2016
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
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30 results for Arvind Sridhar
ICCAD 2015 contest in 3D interlayer cooling optimized network
- Arvind Sridhar
- Mohamed M. Sabry
- et al.
- 2015
- ICCAD 2015
Modeling and multi-objective optimization of 2.5D inductor-based Fully Integrated Voltage Regulators for microprocessor applications
- Pedro André Martins Bezerra
- Florian Krismer
- et al.
- 2015
- COBEP/SPEC 2015
Thermal design of a hierarchical radially expanding cavity for two-Phase cooling of integrated circuits
- Arvind Sridhar
- Chin Lee Ong
- et al.
- 2015
- InterPACK 2015
Benchmarking study on the thermal management landscape for 3D ICS: from back-side to volumetric heat removal
- Thomas Brunschwiler
- Arvind Sridhar
- et al.
- 2015
- InterPACK 2015
PowerCool: Simulation of integrated microfluidic power generation in bright silicon MPSoCs
- Arvind Sridhar
- Mohamed M. Sabry
- et al.
- 2014
- ICCAD 2014
Integrated microfluidic power generation and cooling for bright silicon MPSoCs
- Mohamed M. Sabry
- Arvind Sridhar
- et al.
- 2014
- DATE 2014
STEAM: A fast compact thermal model for two-phase cooling of integrated circuits
- Arvind Sridhar
- Yassir Madhour
- et al.
- 2013
- ICCAD 2013
3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
- Arvind Sridhar
- Alessandro Viricenzi
- et al.
- 2010
- ICCAD 2010
Benchmarking study on the thermal management landscape for three-dimensional integrated circuits: From back-side to volumetric heat removal
- Thomas Brunschwiler
- Arvind Sridhar
- et al.
- 2016
- ASME Journal of Electronic Packaging