The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue
- Donald W. Henderson
- James J. Woods
- et al.
- 2004
- Journal of Materials Research
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
Date
Featured collections
Popular topics
3 results for M.A. Korhonen
The effect of current density, stripe length, stripe width, and temperature on resistance saturation during electromigration testing
- R. Filippi
- R.A. Wachnik
- et al.
- 2002
- Journal of Applied Physics
Stress evolution due to electromigration in confined metal lines
- M.A. Korhonen
- P. Borgesen
- et al.
- 1993
- Journal of Applied Physics