Effect of nonconducting filler additions on ACA properties and the reliability of ACA flip-chip on organic substrates
- Myung-Jin Yim
- Kyung-Wook Paik
- 2001
- IEEE Transactions on Components and Packaging Technologies
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.