Structural demonstration of cost effective Isolation Trench fill for sub-110nm vertical trench DRAM and SOC applications
- S.-W. Yang
- W.-S. Liao
- et al.
- 2003
- VLSI-TSA 2003
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.