Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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148 results for Thomas M. Shaw

Reliability challenges with ultra-low k interlevel dielectrics
- - J.R. Lloyd
  - M. Lane
  - et al.
- 2004
- Microelectronics Reliability
Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- - D. Edelstein
  - H.S. Rathore
  - et al.
- 2004
- IRPS 2004
Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- - R. Filippi
  - J.F. McGrath
  - et al.
- 2004
- IRPS 2004
Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- - D. Edelstein
  - H.S. Rathore
  - et al.
- 2004
- IRPS 2004
Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- - R. Filippi
  - J.F. McGrath
  - et al.
- 2004
- IRPS 2004
Moisture and oxygen uptake in Low K/ copper interconnect structures
- - T.M. Shaw
  - D. Jimerson
  - et al.
- 2003
- ADMETA 2003
The effect of forming gas annealing on Pt/(Ba,Sr)TiO₃/Pt thin film capacitors for future dram applications: Electrical properties and degradation mechanisms
- - J.D. Baniecki
  - C. Parks
  - et al.
- 2001
- MRS Online Proceedings Library
Bottom electrode effects in controlling orientation of lead zirconate titanate films deposited by chemical solution deposition
- - Deborah A. Neumayer
  - Katherine L. Saenger
  - et al.
- 1999
- MRS Proceedings 1999
Low temperature hydrogen induced degradation of (Ba,Sr)TiO₃ thin film capacitors
- - J.D. Baniecki
  - C. Parks
  - et al.
- 1999
- MRS Proceedings 1999
A high performance 0.13 μm copper BEOL technology with low-k dielectric
- - R.D. Goldblatt
  - B.N. Agarwala
  - et al.
- 2000
- IITC 2000