Nondestructive defect characterization of saw-damage-etched multicrystalline silicon wafers using scanning electron acoustic microscopy
- Lei Meng
- Satyavolu S. Papa Rao
- et al.
- 2013
- IEEE Journal of Photovoltaics
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.