Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP)
- Yannick Feurprier
- Katie Lutker-Lee
- et al.
- 2015
- SPIE Advanced Lithography 2015
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.