EUV single exposure via patterning at aggressive pitch
- Jing Guo
- Jennifer Church
- et al.
- 2021
- SPIE Advanced Lithography 2021
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
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10 results for Cody Murray
Strategies for aggressive scaling of EUV multi-patterning to sub-20 nm features
- A. Dutta
- Jennifer Church
- et al.
- 2020
- SPIE Advanced Lithography 2020
Leveraging sub-E0 dose assessment methodology to improve EUV lithography cluster dose performance
- Chris Robinson
- Cody Murray
- et al.
- 2020
- SPIE Advanced Lithography 2020
Material and process improvements towards sub 36nm pitch EUV single exposure
- Karen Petrillo
- Dave Hetzer
- et al.
- 2019
- ANTS 2019
The defect mitigation on EUV stack by track based technology
- Naoki Shibata
- Lior Huli
- et al.
- 2019
- SPIE Advanced Lithography 2019
Track based techniques to improve high-resolution EUV patterning defectivity
- Naoki Shibata
- Lior Huli
- et al.
- 2018
- EUVL 2018
Coater/developer based techniques to improve high-resolution EUV patterning defectivity
- Koichi Hontake
- Lior Huli
- et al.
- 2017
- SPIE Photomask Technology + EUV Lithography 2017
Driving down defect density in composite EUV patterning film stacks
- Luciana Meli
- Karen Petrillo
- et al.
- 2017
- SPIE Advanced Lithography 2017
Essential edge protection techniques for successful multi-wafer stacking
- Joshua Rubin
- Kevin Winstel
- et al.
- 2015
- S3S 2015
SOI FinFET soft error upset susceptibility and analysis
- Phil Oldiges
- Ken Rodbell
- et al.
- 2015
- IRPS 2015