Transient modeling of TSV-wire electromigration and lifetime analysis of power distribution network for 3D ICs
- Xin Zhao
- Yang Wan
- et al.
- 2013
- ICCAD 2013
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.