Heterogeneous integration of III-V materials by direct wafer bonding for high-performance electronics and optoelectronics
- Daniele Caimi
- Preksha Tiwari
- et al.
- 2021
- IEEE T-ED
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.