High thermal conductivity underfill for the thermal management of three-dimensional (3D) chip stacks
- Keiji Matsumoto
- Hiroyuki Mori
- et al.
- 2014
- SEMI-THERM 2014
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.