Technology challenges and enablers to extend Cu metallization to beyond 7 nm node
- Takeshi Nogami
- H. Huang
- et al.
- 2019
- VLSI Technology 2019
Bio
Nick earned a B.S. in physics from Syracuse University and a Ph.D. in physics from Rensselaer Polytechnic Institute (RPI) in Troy, NY. He joined IBM in 2016 as part of the back-end-of-line (BEOL) integration team and currently works on leading edge technology development with a focus on design-technology co-optimization (DTCO.) Nick was named an IBM Master Inventor in 2020 and again in 2023. He currently serves on the committee for the IEEE International Interconnect Technology Conference.
Publications
Electron Transport Across Cu/Ta(O)/Ru(O)/Cu Interfaces in Advanced Vertical Interconnects
- Nicholas A. Lanzillo
- Benjamin D. Briggs
- et al.
- 2019
- Computational Materials Science
An evaluation of Fuchs-Sondheimer and Mayadas-Shatzkes models below 14nm node wide lines
- R. S. Smith
- E. T. Ryan
- et al.
- 2019
- AIP Advances
Impact of Line and Via Resistance on Device Performance at the 5nm Gate All Around Node and beyond
- Nicholas A. Lanzillo
- Koichi Motoyama
- et al.
- 2018
- IITC 2018
Modified ALD TaN Barrier with Ru Liner and Dynamic Cu Reflow for 36nm Pitch Interconnect Integration
- P. Bhosale
- J. Maniscalco
- et al.
- 2018
- IITC 2018
Validity and Application of the TCR Method to MOL contactS
- E. Milosevic
- Vimal Kamineni
- et al.
- 2018
- IITC 2018
Impact of Liner Metals on Copper Resistivity at beyond 7nm Dimensions
- H. Huang
- Nicholas A. Lanzillo
- et al.
- 2018
- IITC 2018
Process Challenges in Fully Aligned Via Integration for sub 32 nm Pitch BEOL
- Benjamin D. Briggs
- C.B. Pcethala
- et al.
- 2018
- IITC 2018
A first-principles analysis of ballistic conductance, grain boundary scattering and vertical resistance in aluminum interconnects
- Tianji Zhou
- Nicholas A. Lanzillo
- et al.
- 2018
- AIP Advances
Defect and grain boundary scattering in tungsten: A combined theoretical and experimental study
- Nicholas A. Lanzillo
- H. Dixit
- et al.
- 2018
- Journal of Applied Physics
Patents
- US
- 12142525
- JP
- 7572131
- DE
- 11 2020 003 469
- JP
- 7546660
- TW
- I851236
- US
- 12040373
- TW
- I847734
- DE
- 11 2020 003 222
- US
- 11990410
- US
- 11961759
Top collaborators
DD
Dan J. Dechene
Director, Semiconductor Enablement
OG
Oki Gunawan
Research Staff Member
NM
Nathan Marchack
Staff Research Scientist, Quantum and AI Hardware Research
GC
Guy Cohen
Research Staff Member