Study of IMC morphologies and phase characteristics affected by the reactions of Ni and Cu metallurgies with Pb-free solder joints
- Won Kyoung Choi
- Sung K. Kang
- et al.
- 2003
- ECTC 2003
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
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12 results for Won K. Choi
Formation of Ag3Sn plates in Sn-Ag-Cu alloys and optimization of their alloy composition
- Sung K. Kang
- Won Kyoung Choi
- et al.
- 2003
- ECTC 2003
Effects of Mechanical Deformation and Annealing on the Microstructure and Hardness of Pb-Free Solders
- Paul Lauro
- Sung K. Kang
- et al.
- 2003
- Journal of Electronic Materials
The microstructure, thermal fatigue, and failure analysis of near-ternary eutectic Sn-Ag-Cu solder joints
- Sung K. Kang
- Paul Lauro
- et al.
- 2004
- Materials Transactions
Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying
- Sung K. Kang
- Da-Yuan Shih
- et al.
- 2004
- JOM
Effects of phosphorus content on the reaction of electroless Ni-P with Sn and crystallization of Ni-P
- Y.C. Sohn
- Jin Yu
- et al.
- 2004
- Journal of Electronic Materials
Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu
- Sung K. Kang
- Won Kyoung Choi
- et al.
- 2003
- JOM
Study of the reaction mechanism between electroless Ni-P and Sn and its effect on the crystallization of Ni-P
- Y.C. Sohn
- Jin Yu
- et al.
- 2003
- Journal of Materials Research
Studies of the mechanical and electrical properties of lead-free solder joints
- S.K. Kang
- W.K. Choi
- et al.
- 2002
- Journal of Electronic Materials
A study of the effects of solder volume on the interfacial reactions in solder joints using the differential scanning calorimetry technique
- W.K. Choi
- S.K. Kang
- et al.
- 2002
- Journal of Electronic Materials