The effect of power islands on delta-I noise, interconnect noise, and timing for wide, on-chip data-buses
- A. Deutsch
- H. Smith
- et al.
- 2005
- IEEE Topical Meeting EPEPS 2005
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
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11 results for Hao-Ming Huang
Order selection in passive transmission line macromodels based on the lie decomposition
- I.M. Elfadel
- H.-M. Huang
- 2004
- IEEE Topical Meeting EPEPS 2004
Transient analysis for lossy transmission lines using a method of characteristics based approach
- A.E. Ruehli
- H.-M. Huang
- et al.
- 2002
- IEEE Topical Meeting EPEPS 2002
Three test problems for the comparison of lossy transmission line algorithms
- A.E. Ruehli
- A.C. Cangellaris
- et al.
- 2002
- IEEE Topical Meeting EPEPS 2002
Lossy transmission line passive macromodeling algorithm - Three case studies
- A. Domavis
- I.M. Elfadel
- et al.
- 2002
- IEEE Topical Meeting EPEPS 2002
Accuracy and performance of passive transmission line macromodels based on optimal matrix rational approximations
- I.M. Elfadel
- A. Dounavis
- et al.
- 2002
- IEEE Topical Meeting EPEPS 2002
A comparative study of two transient analysis algorithms flor lossy transmission lines with frequency-dependent data
- Ibrahim M. Elfadel
- Hao-Ming Huang
- et al.
- 2002
- IEEE Transactions on Advanced Packaging
A comparative study of two transient analysis algorithms for lossy transmission lines with frequency-dependent data
- I.M. Elfadel
- H.-M. Huang
- et al.
- 2001
- IEEE Topical Meeting EPEPS 2001
Investigation of the numerical accuracy of transmission line-based transient analysis of high-speed interconnects and cables
- Andreas C. Cangellaris
- Karen M. Coperich
- et al.
- 2001
- EMC 2001
Transient analysis of lossy transmission lines: An efficient approach based on the method of characteristics
- Stefano Grivet-Talocia
- Hao-Ming Huang
- et al.
- 2004
- IEEE Transactions on Advanced Packaging