Simulation and design methodology for a 50-Gb/s multiplexer/demultiplexer package
- Lei Shan
- Mounir Meghelli
- et al.
- 2002
- IEEE Transactions on Advanced Packaging
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
Date
Featured collections
Popular topics
32 results at IEEE Transactions on Advanced Packaging
A comparative study of two transient analysis algorithms flor lossy transmission lines with frequency-dependent data
- Ibrahim M. Elfadel
- Hao-Ming Huang
- et al.
- 2002
- IEEE Transactions on Advanced Packaging
Physically consistent transmission line models for high-speed interconnects in lossy dielectrics
- Karen M. Coperich Branch
- Jason Morsey
- et al.
- 2002
- IEEE Transactions on Advanced Packaging
A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures
- Lijun Jiang
- Chuan Xu
- et al.
- 2010
- IEEE Transactions on Advanced Packaging
Electromagnetic modeling of through-silicon via (TSV) interconnections using cylindrical modal basis functions
- Ki Jin Han
- Madhavan Swaminathan
- et al.
- 2010
- IEEE Transactions on Advanced Packaging
Waveform relaxation time domain solver for subsystem arrays
- Giulio Antonini
- Albert E. Ruehli
- 2010
- IEEE Transactions on Advanced Packaging
Random rough surface effects on wave propagation in interconnects
- Leung Tsang
- Henning Braunisch
- et al.
- 2010
- IEEE Transactions on Advanced Packaging
Integrated microfluidic cooling and interconnects for 2D and 3D chips
- Bing Dang
- Muhannad S. Bakir
- et al.
- 2010
- IEEE Transactions on Advanced Packaging
160 Gb/s bidirectional polymer-waveguide board-level optical interconnects using CMOS-cased transceivers
- Fuad E. Doany
- Clint L. Schow
- et al.
- 2009
- IEEE Transactions on Advanced Packaging
Is 25 Gb/s on-board signaling viable?
- Dong G. Kam
- Mark B. Ritter
- et al.
- 2009
- IEEE Transactions on Advanced Packaging